DC Brushless Fans (BLDC)

87 Results
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  • CONGA-TC170/CSP-B
    CONGA-TC170/CSP-B

    CPU & Chip Coolers Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are with 2.7mm bore hole.

    manufacturer: congatec

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    • MOQ1
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  • CONGA-TC170/CSP-T
    CONGA-TC170/CSP-T

    CPU & Chip Coolers Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded.

    manufacturer: congatec

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    • MOQ1
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  • CONGA-TC570/CSP-HP-T
    CONGA-TC570/CSP-HP-T

    CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.

    manufacturer: congatec

    • InventoryIn Stock
    • MOQ1
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  • CONGA-SA7/I-CSP-B
    CONGA-SA7/I-CSP-B

    CPU & Chip Coolers Passive cooling solution for SMARC 2.1 module conga-SA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.

    manufacturer: congatec

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    • MOQ1
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  • TC670/CSA-HP-T
    TC670/CSA-HP-T

    CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.

    manufacturer: congatec

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    • MOQ1
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  • HPC/CALS-CSA-HP-T
    HPC/CALS-CSA-HP-T

    CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/cALS with integrated heat pipes, 30mm height and two integrated 12V fans.. All standoffs are M2.5mm threaded.

    manufacturer: congatec

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  • TCV2/CSA-HP-T
    TCV2/CSA-HP-T

    CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.

    manufacturer: congatec

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  • SKIT/APL
    SKIT/APL

    CPU & Chip Coolers Starterkit for SMARC 2.0 with SMARC module based on Intel Atom E3900 processor series. Includes congatec SMARC evaluation carrier board conga-SEVAL, SMARC module conga-SA5, cooling solution, adapters and cables.

    manufacturer: Congatec

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  • CONGA-HPC/CTLU-CSP-HP-B
    CONGA-HPC/CTLU-CSP-HP-B

    CPU & Chip Coolers Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

    manufacturer: Congatec

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    • MOQ1
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  • CONGA-TC570/CSA-HP-B
    CONGA-TC570/CSA-HP-B

    CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

    manufacturer: Congatec

    • InventoryIn Stock
    • MOQ1
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  • CONGA-TS570/CSA-HP-B
    CONGA-TS570/CSA-HP-B

    CPU & Chip Coolers

    manufacturer: Congatec

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    • MOQ1
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  • CONGA-QMX8/CSP-T
    CONGA-QMX8/CSP-T

    CPU & Chip Coolers Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.

    manufacturer: congatec

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    • MOQ1
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  • CONGA-TR4/CSP-HP-B
    CONGA-TR4/CSP-HP-B

    CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.

    manufacturer: congatec

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    • MOQ1
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  • CONGA-TR4/CSP-HP-T
    CONGA-TR4/CSP-HP-T

    CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.

    manufacturer: congatec

    • InventoryIn Stock
    • MOQ1
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  • CONGA-SMX8/I-CSP-B
    CONGA-SMX8/I-CSP-B

    CPU & Chip Coolers Passive cooling solution for SMARC 2.0 module conga-SMX8 with lidded NXP i.MX 8 ARM processor. All standoffs are with 2.7mm bore hole.

    manufacturer: congatec

    • InventoryIn Stock
    • MOQ1
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  • CONGA-PA5/I-CSP-T
    CONGA-PA5/I-CSP-T

    CPU & Chip Coolers Passive cooling solution for conga-PA5 based on lidded Intel Atom E3900 processors with 12mm heatsink fins. All standoffs are 2.5mm thread.

    manufacturer: congatec

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  • CONGA-B7AC/CSP-CU-T
    CONGA-B7AC/CSP-CU-T

    CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height * Cu = copper plate * T = M2.5 Threaded standoffs

    manufacturer: congatec

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  • CONGA-B7AC/CSP-CU-B
    CONGA-B7AC/CSP-CU-B

    CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height * Cu = copper plate * B = Bore hole standoffs

    manufacturer: congatec

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    • MOQ1
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  • TCV2/CSP-HP-B
    TCV2/CSP-HP-B

    CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.

    manufacturer: congatec

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    • MOQ1
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  • HPC/SILH-CSA-HP-B
    HPC/SILH-CSA-HP-B

    CPU & Chip Coolers Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs2.7mm.

    manufacturer: congatec

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    • MOQ1
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