DC Brushless Fans (BLDC)
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Product Type
Subcategory
- CONGA-TC170/CSP-B
CPU & Chip Coolers Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are with 2.7mm bore hole.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-TC170/CSP-T
CPU & Chip Coolers Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-TC570/CSP-HP-T
CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-SA7/I-CSP-B
CPU & Chip Coolers Passive cooling solution for SMARC 2.1 module conga-SA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- TC670/CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- HPC/CALS-CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/cALS with integrated heat pipes, 30mm height and two integrated 12V fans.. All standoffs are M2.5mm threaded.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- TCV2/CSA-HP-T
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-HPC/CTLU-CSP-HP-B
CPU & Chip Coolers Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.
manufacturer: Congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-TC570/CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
manufacturer: Congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-QMX8/CSP-T
CPU & Chip Coolers Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-TR4/CSP-HP-B
CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-TR4/CSP-HP-T
CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-SMX8/I-CSP-B
CPU & Chip Coolers Passive cooling solution for SMARC 2.0 module conga-SMX8 with lidded NXP i.MX 8 ARM processor. All standoffs are with 2.7mm bore hole.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-PA5/I-CSP-T
CPU & Chip Coolers Passive cooling solution for conga-PA5 based on lidded Intel Atom E3900 processors with 12mm heatsink fins. All standoffs are 2.5mm thread.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-B7AC/CSP-CU-T
CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height * Cu = copper plate * T = M2.5 Threaded standoffs
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- CONGA-B7AC/CSP-CU-B
CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height * Cu = copper plate * B = Bore hole standoffs
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- TCV2/CSP-HP-B
CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1
- HPC/SILH-CSA-HP-B
CPU & Chip Coolers Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs2.7mm.
manufacturer: congatec
- InventoryIn Stock
- MOQ1
- SPQ1