CONGA-B7AC/CSP-CU-B
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31240734-CONGA-B7AC/CSP-CU-B
CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height * Cu = copper plate * B = Bore hole standoffs
CONGA-TC170/CSP-B
congatecCPU & Chip Coolers Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are with 2.7mm bore hole.CONGA-TC170/CSP-T
congatecCPU & Chip Coolers Passive cooling solution for COM Express Compact modules conga-TC97, conga-TC170 and conga-TC175. All standoffs are M2.5 threaded.CONGA-TC570/CSP-HP-T
congatecCPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread.CONGA-SA7/I-CSP-B
congatecCPU & Chip Coolers Passive cooling solution for SMARC 2.1 module conga-SA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.TC670/CSA-HP-T
congatecCPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC670 with integrated heat pipes, 25.5mm height and integrated 12V fan. All standoffs are M2.5mm threaded.HPC/CALS-CSA-HP-T
congatecCPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/cALS with integrated heat pipes, 30mm height and two integrated 12V fans.. All standoffs are M2.5mm threaded.TCV2/CSA-HP-T
congatecCPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.SKIT/APL
CongatecCPU & Chip Coolers Starterkit for SMARC 2.0 with SMARC module based on Intel Atom E3900 processor series. Includes congatec SMARC evaluation carrier board conga-SEVAL, SMARC module conga-SA5, cooling solution, adapters and cables.CONGA-HPC/CTLU-CSP-HP-B
CongatecCPU & Chip Coolers Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.CONGA-TC570/CSA-HP-B
CongatecCPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.