Thermal - Heat Sinks
Manufacturer+1
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Designed for
Length
Width
Height
RoHS
Type
Mounting Styles
Unit Weight
Fin Style
For Use With
- EDMHS12M2T2020125KIT
Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITE
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1
- EDMHSCP12201001
Heat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1
- PICOHS06M2T2020150KIT
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1
- PICOHS06M2T2020175KIT
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1
- InventoryIn Stock
- MOQ1
- SPQ1
- PICOHS06M2T2020125KIT
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITE
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1
- PICOHS06M2T2020075KIT
Heat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1
- PICOHS12M2T2020175KIT
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINI
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1
- PICOHS12M2T2020075KIT
Heat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8M
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1
- PICOHEATSINKKIT
Heat Sinks PICO HEATSINK + THERMAL PAD + SCREWS + SPACERS + NUTS
manufacturer: TechNexion
- InventoryIn Stock
- MOQ1
- SPQ1