WB-HS
-
31679123-WB-HS
Heat Sinks WANDBOARD HEATSINK
EDMHS12M2T2020125KIT
TechNexionHeat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.25 MM THICKNESS FOR NXP I.MX6 SOLO / DUALLITEEDMHSCP12201001
TechNexionHeat Sinks EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLARPICOHS06M2T2020150KIT
TechNexionHeat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.50 MM THICKNESS FOR NXP i.MX6 UL/ULL OR i.MX6 QUAD UNLIDDED or i.MX7PICOHS06M2T2020175KIT
TechNexionHeat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINIWB-HS
TechNexionHeat Sinks WANDBOARD HEATSINKPICOHS06M2T2020125KIT
TechNexionHeat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 1.25 MM THICKNESS FOR NXP i.MX6 SOLO OR DUALLITEPICOHS06M2T2020075KIT
TechNexionHeat Sinks PICO LOW-PROFILE HEATSINK 6MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8MPICOHS12M2T2020175KIT
TechNexionHeat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 1.75 MM THICKNESS FOR NXP i.MX8M MINIPICOHS12M2T2020075KIT
TechNexionHeat Sinks PICO LOW-PROFILE HEATSINK 12MM + THERMOPAD WITH 0.75 MM THICKNESS FOR NXP i.MX6 QUAD LIDDED OR i.MX8MPICOHEATSINKKIT
TechNexionHeat Sinks PICO HEATSINK + THERMAL PAD + SCREWS + SPACERS + NUTS