AS568-221 EPDM
QFN
36684812-AS568-221 EPDM
Mounting Hardware O-Ring, EPDM, 70 Durometer Hardness, 0.139 Cross Section, 1.421 ID, 1500 PSI
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a count of all of the component leads (or pins)