4489
8-DIP (0.300, 7.62mm)
5371616-4489
L9110H H-BRIDGE 8DIP MOTOR DRIVE
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
The center distance from one pole to the next.
The measurement of insulation resistance is carried out by means of a megohmmeter – high resistance range ohmmeter. A general rule-of-thumb is 10 Megohm or more.