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Advanced Thermal Solutions, Inc. ATS-FP-70W-12-C
Part No:
ATS-FP-70W-12-C
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
31493864-ATS-FP-70W-12-C
Description:
Thermoelectric Assemblies Air-to-Plate Thermoelectric Assembly, 56W Max Cooling Power, 12VDC, 8.4A Current
Products specifications
- Factory Pack QuantityFactory Pack Quantity1
- TradenameAir-to-Plate
- Unit Weight5.732 lbs
- Minimum Operating Temperature0 C
- Maximum Operating Temperature
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
+ 70 C - Cooling Power70W
- RoHSDetails
- SeriesATS-FP
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk - TypeAir-to-Plate
- Width130 mm
- Length200 mm
- Height117 mm
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