AGASTAT 2-146467-9

Mounting Type

Through Hole

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Series

AMPMODU Mod II

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

Number of Positions

29

Color

Black

Number of Rows

1

Pitch

0.100 (2.54mm)

Contact Finish - Post (Mating)

Gold

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

-

Length - Stack Height

0.270 (6.858mm)

Length - Overall Pin

0.930 (23.622mm)

Length - Post (Mating)

0.330 (8.382mm)

Contact Finish Thickness - Post (Mating)

15.0µin (0.38µm)

Length - Tail

0.330 (8.382mm)