AS4C1G32MD4V-046BIN

Alliance Memory, Inc. AS4C1G32MD4V-046BIN

Part No:

AS4C1G32MD4V-046BIN

Datasheet:

-

Package:

200-VFBGA

AINNX NO:

68819742-AS4C1G32MD4V-046BIN

Category:

Oscillators

Description:

IC DRAM 32GBIT LVSTLE 200FBGA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    200-VFBGA
  • Supplier Device Package
    200-FBGA (10x15)
  • Mfr
    Alliance Memory, Inc.
  • Memory Types
    Volatile
  • Base Product Number
    AS4C1G32
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 95°C (TC)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Voltage - Supply
    1.06V ~ 1.17V, 1.7V ~ 1.95V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    32Gbit
  • Clock Frequency
    4.266 GHz
  • Access Time
    3.5 ns
  • Memory Format
    DRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    LVSTLE_06
  • Write Cycle Time - Word, Page
    18ns
  • Memory Organization
    1G x 32
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