10AS027H2F35E2LG

ALTERA 10AS027H2F35E2LG

Part No:

10AS027H2F35E2LG

Manufacturer:

ALTERA

Datasheet:

-

Package:

FBGA-1152

AINNX NO:

38150534-10AS027H2F35E2LG

Description:

1152-PIN FBGA

Products specifications
  • Mounting Type
    Front Mount
  • Package / Case
    FBGA-1152
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    3
  • Number of Terminals
    1152
  • Manufacturer Part Number
    U0957-45
  • Approvals
    CSA, UL
  • Manufacturer
    Turck
  • Number of I/Os
    384
  • Moisture Sensitive
    Yes
  • Shipping Restrictions
    This product may require additional documentation to export from the United States.
  • L1 Cache Instruction Memory
    2 x 32 kB
  • Maximum Clock Frequency
    1.2 GHz
  • Number of Logic Elements
    270000 LE
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Mounting Styles
    SMD/SMT
  • Number of Logic Array Blocks - LABs
    33750 LAB
  • Part # Aliases
    964930
  • Brand
    Intel / Altera
  • Tradename
    Arria 10 SoC
  • RoHS
    Details
  • L1 Cache Data Memory
    2 x 32 kB
  • Data RAM Size
    -
  • Package Description
    BGA, BGA1152,34X34,40
  • Package Style
    GRID ARRAY
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA1152,34X34,40
  • Supply Voltage-Nom
    0.9 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Supply Voltage-Min
    0.87 V
  • Operating Temperature-Max
    100 °C
  • Rohs Code
    Yes
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    INTEL CORP
  • Supply Voltage-Max
    0.93 V
  • Risk Rank
    5.43
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 100°C (TJ)
  • Series
    Arria 10 SX
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Subcategory
    SOC - Systems on a Chip
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    compliant
  • Current Rating

    Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

    4 A
  • JESD-30 Code
    S-PBGA-B1152
  • Number of Outputs
    384
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    0.9 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Speed
    1.5GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA, POR, WDT
  • Program Memory Size
    -
  • Connectivity
    EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Number of Inputs
    384
  • Seated Height-Max
    3.5 mm
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    SoC FPGA
  • Primary Attributes
    FPGA - 270K Logic Elements
  • Number of Logic Cells

    An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

    270000
  • Number of Cores
    2 Core
  • Flash Size
    --
  • Product Category

    a particular group of related products.

    SoC FPGA
  • IP Rating

    IP (or "Ingress Protection") ratings are defined in international standard EN 6529 (British BS EN 6529:1992, European IEC 659:1989). They are?used to define levels of sealing effectiveness of electrical enclosures against intrusion from foreign bodies?(tools, dirt etc) and moisture.

    IP67
  • Length
    0.2 m
  • Width
    35 mm
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