S71JL064HB0BAW01

AMD S71JL064HB0BAW01

Part No:

S71JL064HB0BAW01

Manufacturer:

AMD

Datasheet:

Package:

-

AINNX NO:

69086825-S71JL064HB0BAW01

Category:

Specialized

Description:

Memory Circuit, Flash+SRAM, CMOS, PBGA73

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    73
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    ADVANCED MICRO DEVICES INC
  • Package Description
    FBGA, BGA73,10X12,32
  • Access Time-Max
    70 ns
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -25 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    FBGA
  • Package Equivalence Code
    BGA73,10X12,32
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    3 V
  • ECCN Code
    EAR99
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.71
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PBGA-B73
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Memory IC Type
    MEMORY CIRCUIT
  • Mixed Memory Type
    FLASH+SRAM
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