American Bright Optoelectronics Corporation BPR-301

Factory Lead Time

10 Weeks

Mounting Type

Through Hole

Package / Case

Module

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2004

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

0.40V VCE, 200NA DARK CURRENT

Voltage - Supply

1.5V

Body Length or Diameter

26.7mm

Body Breadth

7.5 mm

Output Type

ANALOG CURRENT

Termination Type

SOLDER

Output Configuration

NPN - Open Collector/Dark-ON

Current - Supply

50mA

Sensing Method

Reflective

Sensors/Transducers Type

LINEAR POSITION SENSOR,PHOTOELECTRIC,DIFFUSE

Output Range

0.16mA

Operating Current-Max

20mA

Measurement Range-Max

4.5 mm

Measurement Range-Min

4.5 mm

Sensing Object

White Paper

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant