CAT93C86BHU4I-GT3

AMI Semiconductor CAT93C86BHU4I-GT3

Part No:

CAT93C86BHU4I-GT3

Manufacturer:

AMI Semiconductor

Datasheet:

-

Package:

1206 (3216 Metric)

AINNX NO:

40847770-CAT93C86BHU4I-GT3

Category:

Memory

Description:

Products specifications
  • Mounting Type
    Surface Mount, MLCC
  • Package / Case
    1206 (3216 Metric)
  • Supplier Device Package
    8-UDFN-EP (2x3)
  • Package
    Tape & Reel (TR)
  • Base Product Number
    VJ1206
  • Mfr
    Vishay Vitramon
  • Product Status
    Active
  • Voltage Rated

    RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

    25V
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -25°C ~ 85°C
  • Series
    VJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Size / Dimension
    0.126 L x 0.063 W (3.20mm x 1.60mm)
  • Tolerance
    ±20%
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    Y5V (F)
  • Applications
    General Purpose
  • Capacitance
    0.1 µF
  • Technology
    EEPROM
  • Voltage - Supply
    1.8 V ~ 5.5 V
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    -
  • Lead Spacing

    the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

    -
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    16Kb (2K x 8, 1K x 16)
  • Lead Style
    -
  • Clock Frequency
    4MHz
  • Memory Format
    EEPROM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI
  • Write Cycle Time - Word, Page
    -
  • Features
    -
  • Height Seated (Max)
    -
  • Thickness (Max)
    0.035 (0.90mm)
  • Ratings
    -
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