AMI Semiconductor MBD54DWT1

Mounting Type

Surface Mount

Package / Case

6-TSSOP, SC-88, SOT-363

Supplier Device Package

SC-88/SC70-6/SOT-363

RoHS

Non-Compliant

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Other Names

MBD54DWT1OSCT

Current - Average Rectified (Io) (per Diode)

200mA (DC)

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Base Part Number

MBD54D

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

2µA @ 25V

Voltage - Forward (Vf) (Max) @ If

1V @ 100mA

Operating Temperature - Junction

125°C (Max)

Voltage - DC Reverse (Vr) (Max)

30V

Diode Configuration

2 Independent

Reverse Recovery Time (trr)

5ns