MB3-075P (700)
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30894754-MB3-075P (700)
Rectangular MIL Spec Connectors Mother Board 3 ROWS 75 CONT
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
The center distance from one pole to the next.