Amphenol ICC (FCI) HM2R06P1LF

Factory Lead Time

9 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Contact Finish Mating

GOLD OVER NICKEL

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Millipacs®

Published

2009

JESD-609 Code

e4

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Connector Type

Housing for Female Sockets

Number of Positions

3 (Power)

Number of Rows

1

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

YES

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Pitch

0.295 7.50mm

Orientation

Right Angle

Number of Contacts

3

UL Flammability Code

94V-0

Note

Contacts Not Included

Connector Style

Hard Metric, Type N

Connector Usage

Receptacle

Features

Board Guide

Length

25mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant