84648-502HLF

Amphenol Information Communication & Commercial 84648-502HLF

Part No:

84648-502HLF

Datasheet:

-

Package:

-

AINNX NO:

31935912-84648-502HLF

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Terminal Pitch (mm)
    1.27
  • Termination Method
    Solder
  • Body Orientation
    Right Angle
  • Maximum Current Rating (A)
    0.5/Contact
  • Maximum Voltage Rating
    3.3V
  • Insulation Resistance (MOhm)
    100
  • Maximum Contact Resistance (mOhm)
    60
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    85
  • Maximum Insertion Force
    39.2N
  • Mating Cycle (Cycles)
    10000
  • PCB Mounting Side
    Reverse
  • Product Depth (mm)
    85.5
  • Mounting
    Surface Mount
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    PCMCIA
  • Number of Rows
    2
  • Gender
    HDR
  • Number of Contacts
    68
  • Terminal Plating
    Tin
  • Product Length (mm)
    63
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