ams APDE-00

EU RoHS

Compliant

ECCN (US)

EAR99-NLR

HTS

8541.41.00.00

Automotive

No

PPAP

No

Peak Wavelength (nm)

850

Lens Dimensions (mm)

2.5x2.5x0.25

Maximum Forward Voltage (V)

3

Maximum Forward Current (mA)

7

Maximum Reverse Current (uA)

10

Maximum Power Dissipation (mW)

1000

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

80

Thermal Resistance (°C/W)

26

High Brightness

No

High Power

No

Lens Shape Type

Square

Mounting Orientation

Top Mount

Mounting

Surface Mount

Package Width

3.4

Package Length

3.5

PCB changed

2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

2