ams AS3685A-DB-DFN

Factory Lead Time

16 Weeks

Package / Case

DFN

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Output Current per Channel

1A

Utilized IC / Part

AS3685A

Supplied Contents

Board(s)

Evaluation Kit

Yes

Outputs and Type

1, Non-Isolated

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant