Apacer 78.02G63.405

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Pins

200 Pin

Number of Terminals

200

RoHS

Details

Memory Types

DDR2

Factory Pack QuantityFactory Pack Quantity

1

Package Description

DIMM, DIMM200,24

Package Style

MICROELECTRONIC ASSEMBLY

Number of Words Code

128000000

Package Body Material

UNSPECIFIED

Package Equivalence Code

DIMM200,24

Operating Temperature-Max

85 °C

Package Code

DIMM

Package Shape

RECTANGULAR

Part Life Cycle Code

Contact Manufacturer

Ihs Manufacturer

APACER TECHNOLOGY INC

Risk Rank

5.37

Supply Voltage-Nom (Vsup)

1.8 V

Number of Words

134217728 words

Clock Frequency-Max (fCLK)

333 MHz

Manufacturer Part Number

78.02G63.405

Rohs Code

Yes

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

AUTO/SELF REFRESH; WD-MAX

Technology

CMOS

Terminal Position

ZIG-ZAG

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.6 mm

Reach Compliance Code

unknown

JESD-30 Code

R-XZMA-N200

Supply Voltage-Max (Vsup)

1.9 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Voltage-Min (Vsup)

1.7 V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

1 GB

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

1

Speed

667 MT/s

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Organization

128MX64

Seated Height-Max

30.15 mm

Memory Width

64

Memory Density

8589934592 bit

I/O Type

COMMON

Memory IC Type

DDR2 DRAM MODULE

Standby Voltage-Min

1.7 V

Sequential Burst Length

4,8

Interleaved Burst Length

4,8

Access Mode

Distinct operation recognized by the protection mechanisms as a possible operation on an object.

DUAL BANK PAGE BURST

Product

SO-DIMM

Self Refresh

YES

Width

3.8 mm

Length

67.6 mm