Aries Electronics 1107254-16

Factory Lead Time

5 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Number of Pins

16

Housing Material

Polyamide (PA46), Nylon 4/6, Glass Filled

Contact Material - Mating

Beryllium Copper

Contact Material - Post

Brass

Contact Finish Mating

Gold

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Correct-A-Chip® 1107254

Published

2006

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Number of Rows

2

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SOCKET ADAPTER

Current Rating

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

3A

Pitch - Mating

0.100 2.54mm

Lead Pitch

2.54mm

Number of Contacts

16

Contact Finish - Post

Tin

PCB Contact Pattern

RECTANGULAR

Body Breadth

0.7 inch

Lead Length

3.302mm

Body Depth

0.3 inch

Contact Style

RND PIN-SKT

PCB Contact Row Spacing

0.3 mm

Device Socket Type

IC SOCKET

Termination Post Length

0.130 3.30mm

Pitch - Post

0.100 2.54mm

Convert From (Adapter End)

DIP, 0.6 (15.24mm) Row Spacing

Convert To (Adapter End)

DIP, 0.3 (7.62mm) Row Spacing

Contact Finish Thickness - Mating

30.0μin 0.76μm

Contact Finish Thickness - Post

200.0μin 5.08μm

Material Flammability Rating

UL94 V-0

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Flammability Rating

UL94 V-0