Aries Electronics 1109814

Factory Lead Time

6 Weeks

Mount

Through Hole

Material

FR4 Epoxy Glass

Package Accepted

SOIC

Contact Finish Mating

TIN (200)/TIN LEAD OVER NICKEL

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Series

Correct-A-Chip® 1109814

Published

2009

Size / Dimension

0.375Dia 9.53mm

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Number of Positions

8

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ADAPTER

Number of Contacts

8

Lead Length

3.175mm

Device Socket Type

IC SOCKET

Proto Board Type

SMD to DIP

Board Thickness

0.062 1.57mm 1/16

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Lead Free