Aries Electronics 20-M40-11

Factory Lead Time

8 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Contact Materials

BRASS

Insulation Materials

GLASS FILLED THERMOPLASTIC

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2007

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Connector Type

DIP, DIL - Header

Number of Positions

20

Color

Black

Number of Rows

2

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

STRAIGHT, 94V-0, GLASS FILLED POLYAMIDE

Contact Type

Post

Pitch

0.200 5.08mm

Total Number of Contacts

20

Number of Conductors

ONE

Reference Standard

UL

Contact Finish

Gold

Reliability

COMMERCIAL

Number Of PCB Rows

2

Lead Pitch

5.08mm

PCB Contact Pattern

RECTANGULAR

Body Breadth

0.35 inch

Contact Gender

MALE

Body Depth

0.04 inch

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

0.200 (5.08mm)

Body/Shell Style

RECEPTACLE

Contact Finish Thickness

10.0μin 0.25μm

Plating Thickness

10μin

Length - Termination

0.185 inch

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free