3C.SA.DN.6

ARM 3C.SA.DN.6

Part No:

3C.SA.DN.6

Manufacturer:

ARM

Datasheet:

-

Package:

-

AINNX NO:

44916085-3C.SA.DN.6

Category:

Tweezers

Description:

Products specifications
  • RoHS
    Non-Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Tolerance
    0.1 %
  • Number of Terminations
    2
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    50 ppm/°C
  • Resistance
    140 Ω
  • Composition
    Metal Film
  • Power Rating
    125 mW
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    125 mW
  • Features
    Flame Retardant Coating, Military, Moisture Resistant
  • Width
    2.29 mm
  • Length
    6.096 mm
  • Lead Free
    Contains Lead
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