Barker Microfarads 601D397F200HT1

Mounting Type

Through Hole

Manufacturer

BARKER MICROFARADS INC

RoHS

Y

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

P.V.C. SLEEVE (STD.)

Size / Dimension

0.875in D x 3.625in L, Nominal Case Size

Tolerance

-10%/+50% (std.)

Capacitance

390uF

Lead Spacing

the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

1.25in

Voltage

200V

Ripple Current

the pulsed current consumption of non-linear devices like capacitor-input rectifiers.

2.3Arms, +85°C at 120Hz

ESR

0.254-ohm, +25°C at 120Hz