BHC Components 9030070000

Package / Case

Not Required

Lead Spacing (nom)

5 mm

Product Depth (mm)

3.5(mm)

Operating Temp Range

-55C to 100C

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Through Hole

Temp Coeff (Dielectric)

PET

Lead Diameter (nom)

0.5(mm)

Tolerance (+ or -)

10%

Rad Hardened

No

Seated Plane Height

9.1(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

POTTED

Capacitance

150000PF(pF)

Construction

Radial

Termination Style

Radial

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Voltage

63VDC/40VAC

Size(mm)

7.5 X 3.5 X 8.5

Product Length (mm)

7.5(mm)

Product Height (mm)

8.5(mm)