BOPLA BCD 200 FO-7024

Package / Case

QFN

Material

Plastic, Polycarbonate

Product Depth (mm)

5(mm)

Operating Temp Range

-40C to 85C

Mounting Styles

Surface Mount

Lead Free Status / RoHS Status

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For Use With/Related Products

BOCARD 200 System

Package

Bulk

Base Product Number

BCD 200

Mfr

Bopla Enclosures

Product Status

Active

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BOCARD

Size / Dimension

9.016 L x 7.992 W x 0.748 H (229.00mm x 203.00mm x 19.00mm)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Frame

Color

Gray

Pin Count

a count of all of the component leads (or pins)

4

Screening Level

Industrial

Features

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Product Length (mm)

7(mm)

Product Height (mm)

0.9(mm)