Bopla Enclosures BS803F7024

Factory Lead Time

11 Weeks

Material

Plastic, ABS

Body Material

ABS

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

BOS Streamline

Published

2015

Size / Dimension

8.240Lx3.859W 209.30mmx98.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Color

Gray

Design

Hand Held, Split Sides

Container Type

Box

Area (L x W)

31.8in2 (205cm2)

Features

Battery Compartment, AA

Height

1.370 34.80mm

Thickness

0.118 3.00mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Ratings

IP40