Bosch Sensortec SHUTTLE BOARD 3.0 BHI360

Base Product Number

BHI360

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Sensor

Function

Accelerometer, Air Quality, Gyroscope, Humidity, Magnetometer, Pressure, Temperature

Utilized IC / Part

BHI360, BME688, BMM150, BMM350, BMP580

Contents

Board(s)

Interconnect System

Shuttle Board 3.0 Socket