Bourns Inc. 3352P-1-252LF

Factory Lead Time

8 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Weight

283.495231mg

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Trimpot® 3352 - Open Frame

Published

2006

Size / Dimension

Round - 0.350Dia x 0.210 H 8.89mmx5.33mm

Tolerance

±20%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

PC Pins

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

100 ppm/°C

Resistance

2.5kOhms

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

125°C

Min Operating Temperature

-55°C

Composition

Cermet

Power (Watts)

0.5W 1/2W

Power Rating

500mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

500mW

Depth

10.67mm

Base Part Number

3352P

Military Standard

Not

Adjustment Type

Top Adjustment

Number of Turns

1

Height

3.81mm

Length

8.89mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant