Bourns Inc. TISP8201HDMR-S

Factory Lead Time

7 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154, 3.90mm Width)

Number of Pins

8

Weight

135.000429mg

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2006

JESD-609 Code

e3

Pbfree Code

yes

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

8

Terminal Finish

Matte Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

150°C

Min Operating Temperature

-55°C

Applications

General Purpose

Capacitance

65pF

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Base Part Number

TISP82

Pin Count

a count of all of the component leads (or pins)

8

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Working Voltage

120V

Number of Circuits

2

Max Repetitive Reverse Voltage (Vrrm)

120V

Telecom IC Type

SURGE PROTECTION CIRCUIT

Hold Current

the minimum current which must pass through a circuit in order for it to remain in the 'ON' state.

20mA

Height

-100μm

Length

5.6mm

Width

5.6mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant