Brady Corporation 145114

Mounting Type

Surface Mount

Mated Stacking Heights

4mm

Series

WR

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Connector Type

Plug, Outer Shroud Contacts

Number of Positions

100

Number of Rows

2

Pitch

0.020 (0.50mm)

Contact Finish

Gold

Features

Solder Retention

Contact Finish Thickness

3.90µin (0.099µm)

Height Above Board

0.118 (3.00mm)