851-871-FF3

BroadWave Technologies, Inc. 851-871-FF3

Part No:

851-871-FF3

Datasheet:

-

Package:

-

AINNX NO:

69852921-851-871-FF3

Description:

IMP MAT PAD SMA F 50 SMA F 75 DC

Products specifications
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Accessory Type
    Impedance Matching Pad
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