BYTe Semiconductor BY25D40ASMIG(R)

Mounting Type

Surface Mount

Package / Case

8-UFDFN Exposed Pad

Supplier Device Package

8-USON (2x3)

Mfr

BYTe Semiconductor

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C (TA)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Voltage - Supply

2.7V ~ 3.6V

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

4Mbit

Clock Frequency

108 MHz

Access Time

7 ns

Memory Format

FLASH

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

SPI - Dual I/O

Write Cycle Time - Word, Page

2.4ms

Peak Off-state Voltage-Min

Non-Volatile

Memory Organization

512K x 8