BY25D80ASMIG(R)

BYTe Semiconductor BY25D80ASMIG(R)

Part No:

BY25D80ASMIG(R)

Manufacturer:

BYTe Semiconductor

Datasheet:

BY25D80AS.pdf

Package:

8-UFDFN Exposed Pad

AINNX NO:

68825410-BY25D80ASMIG(R)

Category:

Memory

Description:

IC FLASH 8MBIT SPI/DUAL 8USON

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    8-UFDFN Exposed Pad
  • Supplier Device Package
    8-USON (2x3)
  • Mfr
    BYTe Semiconductor
  • Memory Types
    Non-Volatile
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Voltage - Supply
    2.7V ~ 3.6V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    8Mbit
  • Clock Frequency
    108 MHz
  • Access Time
    7 ns
  • Memory Format
    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI - Dual I/O
  • Write Cycle Time - Word, Page
    2.4ms
  • Memory Organization
    1M x 8
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