MDB08-B15-04

Canon MDB08-B15-04

Part No:

MDB08-B15-04

Manufacturer:

Canon

Datasheet:

-

Package:

-

AINNX NO:

56445809-MDB08-B15-04

Description:

Cable Assembly RG178/U 0.914m 26AWG 15 POS Micro D-Sub PL Crimp

Products specifications
  • Number of Pins
    15
  • RoHS
    Non-Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Termination
    Crimp
  • Connector Type
    D-Sub
  • Gender
    Male
  • Cable Length

    A nautical unit of measure equal to one tenth of a nautical mile or approximately 1 fathoms.

    914 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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