Central Semiconductor MM3007 TIN/LEAD

Package / Case

TO-39-3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

RoHS

N

Mounting Styles

Through Hole

Transistor Polarity

NPN

Collector- Emitter Voltage VCEO Max

100 V

Emitter- Base Voltage VEBO

5 V

Maximum DC Collector Current

-

Gain Bandwidth Product fT

50 MHz

DC Collector/Base Gain hfe Min

50

DC Current Gain hFE Max

250

Factory Pack QuantityFactory Pack Quantity

500

Tradename

0

Package Style

CYLINDRICAL

Package Body Material

METAL

Reflow Temperature-Max (s)

NOT SPECIFIED

Rohs Code

No

Transition Frequency-Nom (fT)

50 MHz

Manufacturer Part Number

MM3007TIN/LEAD

Package Shape

ROUND

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

CENTRAL SEMICONDUCTOR CORP

Risk Rank

5.82

Series

MM3007

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

JESD-609 Code

e0

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WIRE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

JESD-30 Code

O-MBCY-W3

Configuration

Single

Transistor Application

SWITCHING

Polarity/Channel Type

NPN

JEDEC-95 Code

TO-39

Collector Base Voltage (VCBO)

120 V

DC Current Gain-Min (hFE)

50

Collector-Emitter Voltage-Max

100 V

VCEsat-Max

0.35 V

Collector-Base Capacitance-Max

15 pF