Central Semiconductor Corp CTLDM7120-M832DS TR

Factory Lead Time

6 Weeks

Mounting Type

Surface Mount

Package / Case

8-TDFN Exposed Pad

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Current - Continuous Drain (Id) @ 25℃

1A Ta

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-65°C~150°C TJ

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape (CT)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Reach Compliance Code

compliant

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power - Max

1.65W

FET Type

2 N-Channel (Dual)

Rds On (Max) @ Id, Vgs

100m Ω @ 500mA, 4.5V

Vgs(th) (Max) @ Id

1.2V @ 1mA

Input Capacitance (Ciss) (Max) @ Vds

220pF @ 10V

Gate Charge (Qg) (Max) @ Vgs

2.4nC @ 4.5V

Drain to Source Voltage (Vdss)

20V

Drain Current-Max (Abs) (ID)

1A

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

1.65W

FET Feature

Logic Level Gate