Chiplus Semiconductor CS18LV40965FCR55

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

32

RoHS

Compliant

Package Description

TSOP2-32

Package Style

SMALL OUTLINE, THIN PROFILE

Number of Words Code

512000

Package Body Material

PLASTIC/EPOXY

Risk Rank

5.8

Ihs Manufacturer

CHIPLUS SEMICONDUCTOR CORP

Part Life Cycle Code

Contact Manufacturer

Manufacturer

Chiplus Semiconductor Corp

Package Shape

RECTANGULAR

Package Code

TSOP2

Supply Voltage-Nom (Vsup)

5 V

Number of Words

524288 words

Manufacturer Part Number

CS18LV40965FCR55

Rohs Code

Yes

Operating Temperature-Max

70 °C

Access Time-Max

55 ns

Reflow Temperature-Max (s)

NOT SPECIFIED

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

compliant

JESD-30 Code

R-PDSO-G32

Supply Voltage-Max (Vsup)

5.5 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Supply Voltage-Min (Vsup)

4.5 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ASYNCHRONOUS

Organization

512KX8

Seated Height-Max

1.2 mm

Memory Width

8

Memory Density

4194304 bit

Parallel/Serial

PARALLEL

Memory IC Type

STANDARD SRAM

Width

10.16 mm

Length

20.95 mm

Lead Free

Lead Free