CS16LV81923HI-70

Chiplus Semiconductor Corp CS16LV81923HI-70

Part No:

CS16LV81923HI-70

Datasheet:

Package:

-

AINNX NO:

69138937-CS16LV81923HI-70

Category:

Memory

Description:

Standard SRAM, 512KX16, 70ns, CMOS, PBGA48

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    48
  • Rohs Code
    No
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    CHIPLUS SEMICONDUCTOR CORP
  • Package Description
    FBGA, BGA48,6X8,30
  • Access Time-Max
    70 ns
  • Moisture Sensitivity Levels
    3
  • Number of Words
    524288 words
  • Number of Words Code
    512000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    FBGA
  • Package Equivalence Code
    BGA48,6X8,30
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    3 V
  • JESD-609 Code
    e0
  • ECCN Code
    3A991.B.2.A
  • Terminal Finish
    TIN LEAD
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.41
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    235
  • Terminal Pitch

    The center distance from one pole to the next.

    0.75 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    R-PBGA-B48
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Supply Current-Max
    0.055 mA
  • Organization
    512KX16
  • Output Characteristics
    3-STATE
  • Memory Width
    16
  • Standby Current-Max
    0.000003 A
  • Memory Density
    8388608 bit
  • Parallel/Serial
    PARALLEL
  • I/O Type
    COMMON
  • Memory IC Type
    STANDARD SRAM
  • Standby Voltage-Min
    1.5 V
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