Cinch Connectivity Solutions Midwest Microwave PWD-5530-02-TNC-79

Factory Lead Time

9 Weeks

Package / Case

Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2008

Size / Dimension

5.500Lx1.000W 139.70mmx25.40mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

TNC

Construction

COAXIAL

Frequency

500MHz~18GHz

Specifications

a measure of a material's ability to?conduct heat.?

Isolation (Min) 18dB

RF/Microwave Device Type

SPLITTER

VSWR-Max

1.5

Insertion Loss (dB)

0.3 dB

Input Power-Max (CW)

40dBm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant