Comchip Technology CDBU0130L

Factory Lead Time

8 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

2-SMD, No Lead

Number of Pins

2

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2011

JESD-609 Code

e4

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

ECCN Code

EAR99

Terminal Finish

Gold (Au)

Base Part Number

CDBU0130

Speed

Small Signal =< 200mA (Io), Any Speed

Diode Type

Schottky

Current - Reverse Leakage @ Vr

10μA @ 10V

Voltage - Forward (Vf) (Max) @ If

350mV @ 10mA

Max Reverse Leakage Current

10μA

Operating Temperature - Junction

125°C Max

Max Surge Current

Surge current is a peak non repetitive current. Maximum (peak or surge) forward current = IFSM or if(surge), the maximum peak amount of current the diode is able to conduct in forward bias mode.

1A

Max Reverse Voltage (DC)

30V

Average Rectified Current

Mainly used to characterize alternating voltage and current. It can be computed by averaging the absolute value of a waveform over one full period of the waveform.

100mA

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant