Comchip Technology Corporation Ltd CMSP1013V3-HF

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

3

Transistor Element Material

SILICON

Part Life Cycle Code

Active

Ihs Manufacturer

COMCHIP TECHNOLOGY CO LTD

Package Description

,

Drain Current-Max (ID)

0.54 A

Number of Elements

1

Operating Temperature-Max

150 °C

Operating Temperature-Min

-55 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

ECCN Code

EAR99

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-PDSO-G3

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Polarity/Channel Type

P-CHANNEL

Drain-source On Resistance-Max

0.9 Ω

DS Breakdown Voltage-Min

20 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Feedback Cap-Max (Crss)

15 pF