Conec 47-000001

Mounting Type

Through Hole

Mount

Through Hole

Material - Insulation

Liquid Crystal Polymer (LCP)

Contact Materials

Copper Alloy

Published

2013

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Press-Fit

Connector Type

BOARD CONNECTOR

Number of Positions

170

Color

Black

Number of Rows

2

Gender

Female

Pitch

0.029 0.75mm

Contact Finish

Gold

Card Type

MicroTCA™

Read Out

the process of removing information from an automatic device (such as a computer or sensor) and displaying it in an understandable form.

Dual

Contact Finish Thickness

30.0μin 0.76μm

Card Thickness

0.062 1.57mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant