Cooper Bussmann MOVGT10V060K

Package / Case

2520 (6450 Metric)

Supplier Device Package

SMD

Package

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Base Product Number

X3C21P1

Mfr

TTM Technologies, Inc.

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

500

Manufacturer

Eaton

Brand

Bussmann / Eaton

RoHS

Details

Series

Xinger III®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Applications

LTE, WiMAX

Subcategory

Varistors

Frequency

1.8GHz ~ 2.4GHz

Termination Style

Axial

Power - Max

90W

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

GDTs - Gas Discharge Tubes / Surge Arresters

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

0.22dB

Isolation

23dB

Return Loss

In telecommunications, return loss is a measure in relative terms of the power of the signal reflected by a discontinuity in a transmission line or optical fiber.

24.9dB

Coupler Type

Standard

Coupling Factor

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

3dB

Product

MOV, GDT

Product Category

a particular group of related products.

Varistors