Cree Inc. MLBAWT-A1-R250-000WE7

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

4-SMD, J-Lead Exposed Pad

Number of Pins

4

Thermal Resistance of Package

25°C/W

CCT(K)

3000K

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

XLamp® ML-B

Size / Dimension

0.138Lx0.124W 3.50mmx3.15mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

2A (4 Weeks)

Color

White, Warm

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

250mW

Base Part Number

MLBAWT

Max Current Rating

175mA

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

250mW

Voltage - Forward (Vf) (Typ)

3.3V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

120°

Optoelectronic Device Type

SINGLE COLOR LED

Forward Current

Current which flows upon application of forward voltage.

80mA

Lumens/Watt @ Current - Test

102 lm/W

CRI (Color Rendering Index)

80 (Typ)

Illumination Color

White

Luminous Flux

the measure of the perceived power of light.

23.5 lm

Flux @ 25°C, Current - Test

27lm 24lm~31lm

Height

1.2mm

Height Seated (Max)

0.052 1.33mm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free