Cree Inc. XPEBFR-L1-0000-00601

Factory Lead Time

11 Weeks

Mounting Type

Surface Mount

Package / Case

1414 (3535 Metric)

Thermal Resistance of Package

8°C/W

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

XLamp® XP-E2

Size / Dimension

0.136Lx0.136W 3.45mmx3.45mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Color

Far Red

Voltage - Forward (Vf) (Typ)

1.85V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

140°

Optoelectronic Device Type

SINGLE COLOR LED

Current - Test

350mA

Current - Max

1A

Flux @ Current/Temperature - Test

288mW 275mW~300mW

Wavelength

730nm 720nm ~ 740nm

Height Seated (Max)

0.094 2.39mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant