Cree Inc. XPEGRN-L1-0000-00902

Factory Lead Time

10 Weeks

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

1414 (3535 Metric)

Number of Pins

2

Thermal Resistance of Package

15°C/W

Number of Elements

1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Series

XLamp® XP-E

Size / Dimension

0.136Lx0.136W 3.45mmx3.45mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Color

Green

Power Rating

3.5W

Depth

3.45mm

Base Part Number

XPE

Max Current Rating

1A

Voltage - Forward (Vf) (Typ)

3.4V

Viewing Angle

the angle at which a display can be viewed with acceptable visual performance.

130°

Optoelectronic Device Type

SINGLE COLOR LED

Forward Current

Current which flows upon application of forward voltage.

350mA

Lens Style

Diffused, Dome

Lumens/Watt @ Current - Test

73 lm/W

Lens Color

affect how much visible light reaches people's eyes, how well people see other colors and how well they see contrasts.

Clear

Luminous Flux

the measure of the perceived power of light.

80.6 lm

Dominant Wavelength

530 nm

Height Seated (Max)

0.084 2.13mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free