CTS Corporation APR35-35-25CB

Manufacturer

CTS

Heatsink Material

Aluminum

Brand

CTS Electronic Components

RoHS

Details

Designed for

BGA

Fin Style

-

Series

APR

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Subcategory

Heat Sinks

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Heat Sinks

Product

Accessories

Product Category

a particular group of related products.

Heat Sinks

Thermal Resistance

Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.

1.8 C/W

Height

24.6 mm

Length

34.7 mm