HSC-04

CUI Devices HSC-04

Part No:

HSC-04

Manufacturer:

CUI Devices

Datasheet:

-

Package:

-

AINNX NO:

43967257-HSC-04

Description:

Thrml Mgmt Access Heat Sink Clip Stainless Steel 301 Box

Products specifications
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount
    Through Hole
  • RoHS
    Compliant
  • Factory Pack QuantityFactory Pack Quantity
    1000
  • Mounting Styles
    Panel
  • Manufacturer
    CUI Devices
  • Brand
    CUI Devices
  • Designed for
    -
  • Fin Style
    -
  • Package
    Bag
  • Mfr
    CUI Devices
  • Product Status
    Active
  • For Use With/Related Products
    HSE-B20X and HSE-B20X-01 Series
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Series
    -
  • Termination
    Solder
  • Type
    Mounting Clip
  • Color
    Blue
  • Number of Rows
    1
  • Subcategory
    Heat Sinks
  • Pitch
    5.0038 mm
  • Number of Contacts
    14
  • Voltage
    300 V
  • Number of Levels
    1
  • Current
    15 A
  • Accessory Type
    Heat Sink Clip
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Heat Sinks
  • Number of Positions Per Level
    14
  • Product
    Accessories
  • Product Category

    a particular group of related products.

    Heat Sinks
  • Width
    4 mm
  • Height
    7.2 mm
  • Length
    37.1 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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